Synova

SYNOVA S.A., headquartered in Duillier, Switzerland, manufactures advanced laser cutting systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet®) in a true industrial CNC platform.

Customers benefit from significant yield, an improved cutting quality as well as enhanced capabilities and flexibility for precision machining a wide range of materials. 

SYNOVA’s story begins with the invention of the water-jet guided laser developed in the 1990s at the Federal Institute of Technology (EPFL) in Lausanne, Switzerland. This innovation resolved a number of well-known problems associated with existing cutting technologies in industrial applications. Consequently, Synova was founded in 1997 to make the patented Laser MicroJet (LMJ) technology available to high-tech industrial manufacturers.

Today, SYNOVA has 100 employees with more than 40 engineers in sales and after-sales, application development, engineering, and R&D. Final assembly and testing of the machines are performed in a modern, 2400 square meter facility in Duillier, Switzerland. Since 2003, wholly-owned local subsidiaries with micro-machining centers (MMCs) have been established in the USA, Japan, India and Korea (Germany and China in preparation) for optimized customer support. SYNOVA also relies on partnerships with leading industrial machine manufacturers such as Makino, and cooperates with several research institutions on strategic projects, including the Fraunhofer Institute and the Manufacturing Technology Center (MTC). LMJ machines provide cutting, drilling, edge grinding and dicing solutions for a broad range of precision machining applications, such as:

• Energy and Aviation: Allowing for the processing of superalloys with or without thermal barrier coating (TBC) as well as Ceramic Matrix Composites (CMC) in one simple step, without cracks or delamination and extremely low heat affected zone;
• Tool manufacturing: 2D cutting, drilling, grooving or slicing of PCD, MCD, PcBN or CVD diamond tool bits, 3D ablation (shaping) for cutting single or multiple clearance angles and chamfering K-land;
• Diamond and Jewellery: 3- or 5-axis LMJ systems are perfectly suited for cutting rough diamonds, as well as processing CVD and HPHT diamonds, with marginal weight loss and high yields;
  • Semiconductor: Cutting, grooving and dicing various semiconductor materials such as silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), low-K materials and even coated material, resulting in smooth edges, high wafer fracture strength and less risk of breakage.
  • Medical and Watchmaking: Micromachining a wide range of materials, including stainless steel, titanium, nickel-titanium, cobalt-chromium, ceramics and CMCs, platinum-chromium, Phynox, magnesium alloys, silicon, CVD diamond, platinum-iridium substrates…

SYNOVA is a company with a global reach focused on delivering the highest-quality solutions and services to its customers wherever they are. We strongly believe that the motor of our success and growth are our technology, experience and dedication to our customers, today and tomorrow.